| The MPM Screen Printer starts the manufacturing process by placing solder paste on all the PCB’s copper pads. The accuracy of this placement is critical. The 2030 meets the needs of todays technology by providing an alignment accuracy of +/- .001 inches with a repeatability of +/- .0005 inches. A user defined two-dimensional vision inspection process verifies acceptable print quality. |
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Even though the accuracy of the 2030 is unequalled, the process stills needs to be monitored. The 2030 handles this internally through a computer control system that enables the operator to monitor and customize machine parameters to meet critical process requirements. Other features include the ability to accept panel sizes ranging up to 20 by 16 inches with a thickness range of .015 to .5 of an inch. In addition, an automatic paste dispenser keeps air exposure to a minimum, a programmable automated stencil wiper maintains a clean stencil during operation and real time Statistical Process Control (SPC) data allows quality personnel to monitor and correct any necessary process issues.
PHILIPS TOPAZ-X PICK AND PLACE
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| The Philips Topaz-X pick and place machine is where all components are placed on PCBs. For high-speed placement of components the Topaz-X has eight heads with interchangeable nozzles. The machine is designed to pickup, inspect, align and place up to 18,000 components per hour with outstanding accuracy. |
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Key features include a CCD camera for fuducial alignment, two multi-cameras for component inspection and alignment, and a placement accuracy of +\- .00005 inches. In addition, the Topaz-X has the ability to deal with all component packages including 0201 CHIPs to Micro-BGA’s and is equipped with Philip’s automatic TrayStak™ feeder system that can hold up to thirty standard JEDEC trays, automatically remove empty trays and can load full trays in less than ten seconds.
ELECTOVERT OmniFlo 7 Oven
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| The Omni-Flow 7 is a seven-zone forced convection re-flow oven. Each of the seven zones is computer controlled within a tolerance of +/- 1-degree Celsius. Zones one through five are heating zones and zones six and seven are cooling zones. The re-flow oven is used to gradually heat the assembly until the solder paste reaches a liquid state. |
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Once the solder has been in a liquid state for a specified time and its temperature is then cooled, forming a solid solder joint between the component pins and the pads of the PCB. The assembly is transported through the oven on a pin chain conveyor that can be manually adjusted to accommodate different size PCBs within seconds. The Omni-Flow also has an uninterruptible power supply (UPS) to keep the conveyor running so that assemblies can be evacuated in the event of a power failure.
SIMPLIMATIC MODEL 8130 MAGAZINE UNLOADER
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| The Simplimatic 8130 is a fully automated conveyor system that transports and stores completed assemblies into ESD safe magazines. Each magazine can hold up to fifty completed assemblies. When a magazine is full, the 8130 automatically unloads the full magazine and loads an empty magazine to the starting location without interruption. The assemblies in the full magazine can then be safely transferred to inspection, test and packaging locations. |
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